Прочность связи компаунда с металлом по подслою при отслаивании
| 17:53 Oct 11, 2018 |
| Russian to English translations [PRO] Tech/Engineering - Materials (Plastics, Ceramics, etc.) / Паспорт безопасности компаунда | |||||||
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| 3 +1 | peeling strength between compound and metal substrate |
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| 3 | The bonding strength of the compound with the metal along the sub-layer during peeling |
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Answers
11 mins confidence: 
peer agreement (net): +1
peer agreement (net): +1peeling strength between compound and metal substrate Explanation: .. |
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11 mins confidence:
The bonding strength of the compound with the metal along the sub-layer during peeling Explanation: The peeled surface along the bonding interface between copper and ... The irregular grains in the interlayer reveal the origination of intermetallic compound in the ... According to the Energy Dispersive X-ray (EDX), the sublayer 1, 2 and 3 ... https://books.google.com.ua/books?id=3tfFAgAAQBAJ&pg=PA98&lp... -------------------------------------------------- Note added at 2 hrs (2018-10-11 20:44:52 GMT) -------------------------------------------------- вполне, хотя в оригинале прочность на отрыв прямо не упоминается |
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